Electrochemical deposition of copper on zinc and its alloys

Authors

  • Boris V. Kuznetsov Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

Keywords:

electrochemical deposition, electrolyte, copper coatings, zinc, zinc alloys, propylene glycol, hydroxyethylidene diphosphonic acid

Abstract

A new electrolyte composition and deposition conditions of quality (light, densely packed, homogeneous) copper coatings on zinc and its alloys were found. It was established that the electrochemical deposition of copper is possible from an alkaline solution containing propylene glycol. It was shown that the adding of hydroxyethylidene diphosphonic acid in the solution stabilises the electrolyte during operation and storage. The addition of morpholine provided deposition of quality copper coatings on zinc and its alloys in a wide range of current densities.

Author Biography

  • Boris V. Kuznetsov, Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

    PhD (chemistry), docent; associate professor at the department of inorganic chemistry, faculty of chemistry

References

  1. Pasquale MA, Gassa LM, Arvia AJ. Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives. Electrochimica Acta. 2008;53(20):5891–5904. DOI: 10.1016/j.electacta.2008.03.073.
  2. Kang Moo Seong, Kim Soo-Kil, Kim Keeho, Kim Jae Jeong. The influence of thiourea on copper electrodeposition: adsorbate identification and effect on electrochemical nucleation. Thin Solid Films. 2008;516(12):3761–3766. DOI: 10.1016/j.tsf.2007.06.069.
  3. Dudin PV, Reva OV, Vorobyova TN. High rate of copper electrodeposition from the hexafluorosilicate bath. Surface and Coatings Technology. 2010;204(20):3141–3146. DOI: 10.1016/j.surfcoat.2010.02.062.
  4. Ibrahim MAM, Bakdash RS. New non-cyanide acidic copper electroplating bath based on glutamate complexing agent. Surface and Coatings Technology. 2015;282:139–148. DOI: 10.1016/j.surfcoat.2015.10.024.
  5. Ramírez C, Bozzini B, Calderón JA. Electrodeposition of copper from triethanolamine as a complexing agent in alkaline solution. Electrochimica Acta. 2022;425:140654. DOI: 10.1016/j.electacta.2022.140654.
  6. Lin Chaoyu, Hu Jiaping, Zhang Jinqiu, Yang Peixia, Kong Xiangwei, Han Guofeng, et al. A comparative investigation of the effects of some alcohols on copper electrodeposition from pyrophosphate bath. Surfaces and Interfaces. 2021;22:100804. DOI: 10.1016/j.surfin.2020.100804.
  7. Lin Chun-Cheng, Hu Chi-Chang, Lu Yi-Ting, Guo Ren-Hau. Reconsider the depolarization behavior of copper electrodeposition in the presence of 3-mercapto-1-propanesulfonate. Electrochemistry Communications. 2018;91:75–78. DOI: 10.1016/j.elecom.2018.05.003.
  8. González Mercado GV, González CJ, Oliva MI, Brunetti V, Eimer GA. Morphology of copper deposits obtained by metallic electrodeposition. Procedia Materials Science. 2015;8:635–640. DOI: 10.1016/j.mspro.2015.04.119.
  9. Lizama-Tzec FI, Canché-Canul L, Oskam G. Electrodeposition of copper into trenches from a citrate plating bath. Electrochimica Acta. 2011;56(25):9391–9396. DOI: 10.1016/j.electacta.2011.08.023.
  10. Drissi-Daoudi R, Irhzo A, Darchen A. Electrochemical investigation of copper behaviour in different cupric complex solutions: voltammetric study. Journal of Applied Electrochemistry. 2003;33(3–4):339–343. DOI: 10.1023/a:1024191404595.
  11. Zheng Jingwu, Chen Haibo, Cai Wei, Zhou Jie, Qiao Liang, Jiang Liqiang. Mechanisms of triethanolamine on copper electrodeposition from 1-hydroxyethylene-1,1-diphosphonic acid electrolyte. Journal of the Electrochemical Society. 2017;164(12):D798–D801. DOI: 10.1149/2.0091713jes.
  12. Aravinda CL, Mayanna SM, Muralidharan VS. Electrochemical behaviour of alkaline copper complexes. Journal of Chemical Sciences. 2000;112(5):543–550. DOI: 10.1007/bf02709287.
  13. Pecequilo CV, Panossian Z. Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique. Electrochimica Acta. 2010;55(12):3870–3875. DOI: 10.1016/j.electacta.2010.01.113.
  14. Hamid ZA, Aal AA. New environmentally friendly non-cyanide alkaline electrolyte for copper electroplating. Surface and Coatings Technology. 2009;203(10–11):1360–1365. DOI: 10.1016/j.surfcoat.2008.11.001.
  15. De Almeida MRH, Carlos IA, Barbosa LL, Carlos RM, Lima-Neto BS, Pallone EMJA. Voltammetric and morphological characterization of copper electrodeposition from non-cyanide electrolyte. Journal of Applied Electrochemistry. 2002;32(7):763–773. DOI: 10.1023/a:1020182120035.
  16. Sekar R, Jagadesh KK, Ramesh Bapu GNK. Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes. Surface Engineering. 2015;31(6):433–438. DOI: 10.1179/1743294414y.0000000400.
  17. Sivasakthi P, Sekar R, Ramesh Bapu GNK. Electrodeposition and characterisation of copper deposited from cyanide-free alkaline glycerol complex bath. Transactions of the IMF. 2015;93(1):32–37. DOI: 10.1179/0020296714z.000000000196.
  18. Zheng Jingwu, Zheng Biao, Ying Yao, Qiao Liang, Jiang Liqiang, Zhang Cheng. Anodic behavior of copper in 1-hydroxyethylene-1,1-diphosphonic acid (HEDPA) baths. Advanced Materials Research. 2012;472–475:3–7. DOI: 10.4028/www.scientific.net/amr.472-475.3.

Downloads

Additional Files

Published

2022-08-31

Issue

No. 2 (2022): Journal of the Belarusian State University. Chemistry

Section

Original Articles

License

The authors who are published in this journal agree to the following:

  1. The authors retain copyright on the work and provide the journal with the right of first publication of the work on condition of license Creative Commons Attribution-NonCommercial. 4.0 International (CC BY-NC 4.0).
  2. The authors retain the right to enter into certain contractual agreements relating to the non-exclusive distribution of the published version of the work (e.g. post it on the institutional repository, publication in the book), with the reference to its original publication in this journal.
  3. The authors have the right to post their work on the Internet (e.g. on the institutional store or personal website) prior to and during the review process, conducted by the journal, as this may lead to a productive discussion and a large number of references to this work. (See The Effect of Open Access.)

How to Cite

[1]
Kuznetsov, B.V. 2022. Electrochemical deposition of copper on zinc and its alloys. Journal of the Belarusian State University. Chemistry. 2 (Aug. 2022), 64–69. DOI:https://doi.org/10.33581/2520-257X-2022-2-64-69.