Formation of epitaxial 3C-SiC layers on Si by rapid vacuum thermal processing
Keywords:
epitaxial structures SiC/Si, vacuum carbidisation, rapid thermal processing, thin filmsAbstract
The results of a study of the structure and phase composition of epitaxial layers of silicon carbide (SiC) formed on silicon substrate with orientation (100) under rapid vacuum thermal processing are presented. Planar-view transmission electron microscopy investigation revealed the formation of epitaxial layers of cubic polytype SiC (3C-SiC) on silicon in the process of carbidisation at 1100 °C during 30 s, using a gas mixture of propane (10 %) and argon (90 %) as a carbon source. The formation of a monocrystalline 3C-SiC with polycrystalline inclusions and twins on all possible planes {111} was found. A rather narrow band of 793 cm–1 transverse optical phonon mode SiC on Raman spectra confirms the formation of a cubic polytype SiC. It is noted that the presence of a 180 cm–1 spectral line and a 793 cm–1 half-width band on Raman spectra indicate the presence of deformation defects in SiC.
References
- Ferro G. 3C-SiC heteroepitaxial growth on silicon: the quest for holy grail. Critical Reviews in Solid State and Materials Sciences. 2015;40(1):56–76. DOI: 10.1080/10408436.2014.940440.
- Shenai K, Scott RS, Baliga BJ. Optimum semiconductors for high-power electronics. IEEE Transactions on Electron Devices. 1989;36(9):1811–1823. DOI: 10.1109/16.34247.
- Aldalbahi A, Li E, Rivera M, Velazquez R. A new approach for fabrications of SiC based photodetectors. Scientific Reports. 2016;6(1):23457. DOI: 10.1038/srep23457.
- Skibarko IA, Milchanin OV, Gaiduk PI, Komarov FF, Marks J, Pastuszka B, et al. Structural and optical properties of GaN/SiC/Si heterostructures grown by MBE. In: Ploog KH, Tränkle G, Weimann G, editors. Compound semiconductors – 1999. Proceedings of the 26th International symposium on compound semiconductors; 1999 August 22–26; Berlin, Germany. Bristol: IOP Publishing; 2000. p. 465–469 (Institute of Physics conference series; no. 166).
- Shakir M, Hou S, Hedayati R, Malm BG, Östling M, Zetterling C-M. Towards silicon carbide VLSI circuits for extreme environment applications. Electronics. 2019;8(5):496. DOI: 10.3390/electronics8050496.
- Zimbone M, Sarikov A, Bongiorno C, Marzegalli A, Scuderi V, Calabretta C, et al. Extended defects in 3C-SiC: stacking faults, threading partial dislocations, and inverted domain boundaries. Acta Materialia. 2021;213:116915. DOI: 10.1016/j.actamat.2021.116915.
- Bosi M, Ferrari C, Nilsson D, Ward PJ. 3C-SiC carbonization optimization and void reduction on misoriented Si substrates: from a research reactor to a production scale reactor. CrystEngComm. 2016;18(39):7478–7486. DOI: 10.1039/c6ce01388k.
- Zimbone M, Mauceri M, Litrico G, Barbagiovanni EG, Bongiorno C, La Via F. Protrusions reduction in 3C-SiC thin film on Si. Journal of Crystal Growth. 2018;498:248–257. DOI: 10.1016/j.jcrysgro.2018.06.003.
- Cimalla V, Pezoldt J, Ecke G, Eichhorn G. The buffer layer in RTCVD of SiC. In: Nakashima S, Matsunami H, Yoshida S, Harima H, editors. Silicon carbide and related materials – 1995. Proceedings of the 6th International conference on silicon carbide and related materials; 1995 September 18–21; Kyoto, Japan. Bristol: IOP Publishing; 1996. p. 153–156 (Institute of Physics conference series; no. 142).
- Steckl AJ, Li JP. Epitaxial growth of beta-SiC on Si by RTCVD with C3H8 and SiH4. IEEE Transactions on Electron Devices. 1992;39:64–74. DOI: 10.1109/16.108213.
- Ottaviani L, Lazar M, Locatelli ML, Chante JP, Heera V, Skorupa W, et al. Annealing studies of Al-implanted 6H-SiC in an induction furnace. Materials Science and Engineering: B. 2002;91–92:325–328. DOI: 10.1016/S0921-5107(01)01043-1.
- Wang Z, Liu W, Wang C. Recent progress in ohmic contacts to silicon carbide for high-temperature applications. Journal of Electronic Materials. 2016;45:267–284. DOI: 10.1007/s11664-015-4107-8.
- Roccaforte F, Brezeanu G, Ganmon PM, Giannazzo F, Rascuna S, Saggio M. Schottky contacts to silicon carbide: physics, technology and applications. In: Zekentes K, Vasilevskiy K, editors. Advancing silicon carbide electronics technology I. Metal contacts to silicon carbide: physics, technology, applications. Chapter 3. Millersville: Materials Research Forum LLC; 2018. p. 127–190. DOI: 10.21741/9781945291852-3.
- Skorupa W, Panknin D, Anwand W, Voelskow M, Ferro G, Monteil Y, et al. Flash lamp supported deposition of 3C-SiC (FLASiC) – a promising technique to produce high quality cubic SiC layers. Materials Science Forum. 2004;457–460:175–180. DOI: 10.4028/www.scientific.net/MSF.457-460.175.
- Booker GR. Crystallographic imperfections in silicon. Discussions of the Faraday Society. 1964;38:298–304. DOI: 10.1039/ DF9643800298.
- Komarov FF, Solov’yev VS, Tishkov VS, Shiryayev SY. Thermal recrystallization of silicon amorphous layers after argon, oxygen and nitrogen ion implantation. Radiation Effects. 1983;69(3–4):179–189. DOI: 10.1080/00337578308217822.
- Aksyanov IG, Kompan ME, Kul’kova IV. [Raman scattering in mosaic silicon carbide films]. Fizika tverdogo tela. 2010;52(9): 1724–1728. Russian.
- Sorieul S, Costantini J-M, Gosmain L, Thomé L, Grob J-J. Raman spectroscopy study of heavy-ion-irradiated α-SiC. Journal of Physics: Condensed Matter. 2006;18(22):5235–5251. DOI: 10.1088/0953-8984/18/22/022.
- Kazuchits NM, Korolik OV, Rusetsky MS, Kazuchits VN, Kirilkin NS, Skuratov VA. Raman scattering in diamond irradiated with high-energy xenon ions. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 2020;472:19–23. DOI: 10.1016/j.nimb.2020.03.034.
- Soldatenko SA, Kuzmina VO. Substructure of the epitaxial film of β-SiC synthesized by pyrolysis of methane on (111) Si by the method of PPT [Internet]. In: Sovremennye metody i tekhnologii sozdaniya i obrabotki materialov. Materialy XIII Mezhdunarodnoi nauchno-tekhnicheskoi konferentsii; 12–14 sentyabrya 2018 g.; Minsk, Belarus’ [Modern methods and technologies for the creation and processing of materials. Proceedings of the 13th International scientific and technical conference; 2018 September 12–14; Minsk, Belarus]. Minsk: [s. n.]; 2018 [cited 2022 March 21]. p. 169–175. Russian. Available from: https://rep.bntu.by/handle/data/51257.
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