Electrodeposition of copper – tin alloys from glycol electrolytes

  • Tatsiana N. Vorobyova Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus; Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus
  • Maryia G. Haluza Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus https://orcid.org/0000-0001-6852-5186
  • Olga N. Vryblevskaya Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus; Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus https://orcid.org/0000-0002-4877-0974
  • Aleh V. Paniatouski Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus https://orcid.org/0000-0001-8910-4655
  • Elena A. Veretennikova Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

Abstract

Stable ethylene glycol (EG) and propylene glycol (PG) electrolytes containing СuCl2 · 2H2O, SnCl4 · 5H2O and Trilon B have been developed, which provide electrodeposition of Cu – Sn alloy with tin content varying from 34 to 52 at. % in case of EG and from 51 to 91 at. % in case of PG electrolytes. It is found that the coatings contain phases of Cu6Sn5 и Cu10Sn3 intermetallic compounds, and metallic tin is also present in case of its highest content in the alloy. It is revealed that tin content can be simply varied by the change of current density or concentrations of tin and copper compounds in glycols. The effect of electrolyte composition, deposition conditions, a nature of a substrate on the coatings deposition rate (in the limits of 0.9‒2.9 μm ∙ h‒1), total metal current efficiency (from 40 to 95 %), the ratio of metals in the alloy (from 34 to 91 at. %), its phase composition and microstructure is determined. The conditions for the deposition of Cu – Sn alloy close to the eutectic composition have been found.

Author Biographies

Tatsiana N. Vorobyova, Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus; Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

doctor of science (chemistry), full professor; leading researcher at the laboratory of thin films chemistry, Research Institute for Physical Chemical Problems, Belarusian State University, and professor at the department of inorganic chemistry, faculty of chemistry, Belarusian State University

Maryia G. Haluza, Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

postgraduate student at the department of inorganic chemistry, faculty of chemistry

Olga N. Vryblevskaya, Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus; Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

PhD (chemistry), docent; academic secretary, Research Institute for Physical Chemical Problems, Belarusian State University, and associate professor at the department of inorganic chemistry, faculty of chemistry, Belarusian State University

Aleh V. Paniatouski, Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

student at the faculty of chemistry

Elena A. Veretennikova, Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

student at the faculty of chemistry

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Published
2019-08-28
Keywords: electrochemical deposition, alloy, copper, tin, eutectic, glycol electrolyte, elemental and phase composition, microstructure
How to Cite
Vorobyova, T. N., Haluza, M. G., Vryblevskaya, O. N., Paniatouski, A. V., & Veretennikova, E. A. (2019). Electrodeposition of copper – tin alloys from glycol electrolytes. Journal of the Belarusian State University. Chemistry, 2, 69-78. https://doi.org/10.33581/2520-257X-2019-2-69-78