The solution for removing tin metalloresist from the surface of PCBs copper conductors

  • Larysa I. Stepanova Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus
  • Sergei S. Perevoznikov Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus
  • Katarina V. Skrotskaya Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus

Abstract

This paper compares velocities of tin and copper etching in solution of different compositions. We identified optimal concentration of based components – nitric acid (4.5 mol / L) and Fe(III) ions (0.18 mol / L). To avoid solution’s worm up and toxic nitric oxides allotment during etching, we propose to add to solution stabilizator-inhibitor based on sulfur- and amino-containing derivatives compounds in concentration 0.015 mol / L. Further addition of benzotriazole and chloride ions results in bright and shiny copper etched surface. Tin and copper ions presence in solution accelerates dissolution’s processes of both metals. Polarization data illustrates that anodic copper dissolution is noticeably lower during etching in the presence of both benzotriazole and stabilizator-inhibitor currents. Finally, the analysis of electron microscopic data shows that copper surface after etching is sufficiently smooth and slightly structured with these solution additives. In contrast, etching in other solutions leads to more developed and structured surfaces. 

Author Biographies

Larysa I. Stepanova, Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus

PhD (chemistry), docent; leading researcher at the laboratory of thin films chemistry

Sergei S. Perevoznikov, Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus

researcher at the laboratory of thin films chemistry

Katarina V. Skrotskaya, Research Institute for Physical Chemical Problems, Belarusian State University, 14 Lieninhradskaja Street, Minsk 220006, Belarus

engineer at the laboratory of physical and chemical research methods

References

  1. Kukanskis; Peter E. (Woodbury, CT), Whitmore; Bryan (New Haven, CT), investors; MacDermid, Inc. (Waterbury, CT), assignee. United States Patent 4,921,571. 1990 May 1.
  2. Krulik; Gerald A. (El Toro, CA), investors; Applied Electroless Concepts Inc. (El Toro, CA), assignee. United States Patent 5,219,484. 1993 June 15.
  3. McGrath; Peter T. (Wendelstein, DE), Shah; Narendra K. (Mission Viejo, CA), investors; Ardrox, Inc. (La Mirada, CA), assignee. United States Patent 5,244,539. 1993 September 14.
  4. Cordani; John L. (Waterbury, CT), investors; MacDermid, Inc. (Waterbury, CT), assignee. United States Patent 5,234,542. 1993 August 10.
  5. Singh; Rajwant (Fullerton, CA), Mandich; Nenad (Homewood, IL), Krulik; Gerald A. (San Clemente, CA), investors; Applied Chemical Technologies, Inc. (Santa Ana, CA), assignee. United States Patent 5,512,201. 1996 April 30.
  6. Wong; Kwee C. (Londonderry, NH), investors; The Dexter Corporation (Industry, CA), assignee. United States Patent 5,741,432. 1998 April 21.
  7. Campbell; Scott (Fountain Hills, AZ), investors; Surface Tek Specialty Products, Inc. (Scottsdale, AZ), assignee. United States Patent 5,911,907. 1999 June 15.
  8. Campbell; Scott (Fountain Hills, AZ), investors; Morton International, Inc. (Chicago, IL), assignee. United States Patent 5,928,529. 1999 July 27.
  9. Campbell; Scott (Fountain Hills, AZ), investors; Morton International, Inc. (Chicago, IL), assignee. United States Patent 5,989,449. 1999 November 23.
  10. Johnson, II; Todd (Tempe, AR), Fakler; John T. (Phoenix, AR), investors; Morton International, Inc. (Chicago, IL), assignee. United States Patent 6,258,294. 2001 July 10.
  11. Johnson; Todd II (United States of America); Fakler, John T. (United States of America), investors; Morton International, Inc. (United States of America); Morton International, Inc. (United States of America), assignee. Composition and method for stripping solder and tin from printed circuit boards. Canadian Patent 2,248,497. 2002 February 26.
  12. Blazhevich NN (RU), Aksenenko IS (RU), authors; Federal’noe Gosudarstvennoe Unitarnoe predprijatie «Nauchno-proizvodstvennoe ob’edinenie “Mars”» (RU), assignee. Solution for stripping tin-lead coatings from copper base. Russian Federation 2,257,424. 2005 July 27. Russian.
  13. Kirsanova OV (RU), Frolenkov KJ (RU), authors; Gosudarstvennoe obrazovatel’noe uchrezhdenie vysshego professional’nogo obrazovanija «Orlovskij gosudarstvennyj tekhnicheskij universitet» (OrelGTU). Preferential etch of galvanic tin-and-leaden of coatings from copper basis. Russian Federation 2,351,689. 2009 April 10. Russian.
  14. Frolenkov KJ (RU), Kirsanova OV (RU), Vinokurov AJ (RU), Kramarenko IB (RU), authors; Federal’noe gosudarstvennoe obrazovatel’noe uchrezhdenie vysshego professional’nogo obrazovanija «Gosudarstvennyj universitetuchebno-nauchno-proizvodstvennyj kompleks» (FGOU VPO «Gosuniversitet-UNPK»), assignee. Selective etchant for removal of tin-and-leaden coatings from copper base. Russian Federation 2,470,093. 2012 December 20. Russian.
  15. Shaigan N, Ashrafizadeh SN. A highly stabilized-inhibited nitric acid/ferric nitrate – based solder stripping solution. Journal of Applied Electrochemistry. 2006;36(9):1043–1049. DOI: 10.1007/s10800-006-9157-4.
  16. Frolenkov KYu, Vinokurov AYu, Kirsanova OV. Tin-lead stripping from copper wiring of PCBs. Gal’vanotekhnika i obrabotka poverkhnosti. 2012;20(1):32–48. Russian.
  17. Korshunov AV, Kovaleva SV, Gladishev VP. Influence of nitric acid concentration on composition of it’s reduction products when interacting with copper. Izvestiya Tomskogo politekhnicheskogo universiteta. 2004;307(3):86–89. Russian.
  18. Mamas S. The effect of benzotriazole on brass corrosion. Materials Chemistry and Physics. 2005;93(1):41–47. DOI: 10.1016/j. matchemphys.2005.02.012.
Published
2019-01-19
Keywords: tin, etching, speed, stabilizer-inhibitor, metal consumption
How to Cite
Stepanova, L. I., Perevoznikov, S. S., & Skrotskaya, K. V. (2019). The solution for removing tin metalloresist from the surface of PCBs copper conductors. Journal of the Belarusian State University. Chemistry, 2, 18-24. Retrieved from https://journals.bsu.by/index.php/chemistry/article/view/1237
Issue
No 2 (2018): Journal of the Belarusian State University. Chemistry
Section
Original Articles

Copyright (c) 2018 Journal of the Belarusian State University. Chemistry

Creative Commons License

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

The authors who are published in this journal agree to the following:

  1. The authors retain copyright on the work and provide the journal with the right of first publication of the work on condition of license Creative Commons Attribution-NonCommercial. 4.0 International (CC BY-NC 4.0).
  2. The authors retain the right to enter into certain contractual agreements relating to the non-exclusive distribution of the published version of the work (e.g. post it on the institutional repository, publication in the book), with the reference to its original publication in this journal.
  3. The authors have the right to post their work on the Internet (e.g. on the institutional store or personal website) prior to and during the review process, conducted by the journal, as this may lead to a productive discussion and a large number of references to this work. (See The Effect of Open Access.)