Influence of the rapid thermal treatment of the initial silicon wafers on the process of their pyrogenic oxidation
Keywords:
rapid thermal treatment, disrupted layer, pyrogenic oxidation, refraction ratioAbstract
The work represents the investigation results of influence of rapid thermal treatment of the initial silicon wafers on the process of their pyrogenic oxidation. It is shown that the given treatment results in the quality enhancement of silicon dioxide, formed on their surface owing to thickness reduction of the disrupted layer, substantially influencing the initial stage of the oxidation process.
References
- Krasnikov G. Ya. Konstruktivno-tekhnologicheskie osobennosti submikronnykh MOP-tranzistorov [Design-Technological Peculiarities of the Submicron MOS-Transistors] : in 2 parts. Moscow : Tekhnosfera, 2002. Part 1 (in Russ.).
- Pilipenko V. A. Bystrye termoobrabotki v tekhnologii SBIS [Rapid Thermal Treatments in the VLSI Technology]. Minsk : Publ. Centre of BSU, 2004 (in Russ.).
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Published
2019-02-06
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Condensed State Physics
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How to Cite
(1)
Anishchik, V. M.; Harushka, V. A.; Pilipenka, U. A.; Ponariadov, V. V.; Saladukha, V. A. Influence of the Rapid Thermal Treatment of the Initial Silicon Wafers on the Process of Their Pyrogenic Oxidation. Журнал Белорусского государственного университета. Физика 2019, No. 2, 81-85.












