Sn – Zn – Ga alloys for leadfree soldering obtained by rapid quenching
Abstract
The paper presents the results of a study of the structural-phase state of the foil of eutectic near eutectic Sn – Zn alloys doped by Ga obtained by rapid melt quenching at a melt cooling rate of 105 K/s. Using the methods of X-ray diffraction analysis, scanning electron microscopy, and X-ray spectrometry, it was established that the foil solidifies with the formation of tin-based supersaturated solid solution and its microstructure is formed as a result of the decomposition of the solid solution by discontinuous mechanism at room temperature. The homogeneity of the composition and distribution of gallium and zinc inclusions over the volume of the foil was established. Using the electron backscatter diffraction technique, it was shown that the foils have a microcrystalline structure due to the deep supercooling of the melt, which leads to a high crystal nucleation rate. The grain size decreases depending on the distance to the mold. The increase in grain size is associated with a change in the solidification conditions over the thickness of the foil: deterioration of heat removal and a decrease in supercooling. There is no pronounced grain texture in the foils.
References
- Cheng S, Huang C-M, Pecht M. A review of lead-free solders for electronics applications. Microelectronics Reliability. 2017;75:77–95. DOI: 10.1016/j.microrel.2017.06.016.
- Mayappan R, Jasli NA. Silver effect on the intermetallic growth in the Sn – 8Zn – 3Bi lead-free solder. Materials Today: Proceedings. Part 3. 2018;5(9):17553–17560. DOI: 10.1016/j.matpr.2018.06.072.
- Zhai QJ, Gao YL, Guan WB, Xu KD. Role of size and cooling rate in quenched droplet of Sn – Bi eutectic alloy. Materials Science and Engineering: A. 2006;441(1–2):278–281. DOI: 10.1016/j.msea.2006.08.050.
- Shalaby RM. Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi – Sn based lead-free solder alloys. Materials Science and Engineering: A. 2013;560:86–95. DOI: 10.1016/j.msea.2012.09.038.
- Shepelevich VG. Microstructure and microhardness of rapidly solidified Bi51Sn26 In23 alloy. Journal of the Belarusian State University. Physics. 2017;2:76–82. Russian.
- Shepelevich VG, Koukharenko EL. The ternay alloy structure of the bismuth – indium – tin system. Journal of the Belarusian State University. Physics. 2019;2:54–57. Russian. DOI: 10.33581/2520-2243-2019-2-54-57.
- Wang Z, Chen C, Liu J, Zhang G, Suganuma K. Corrosion mechanism of Zn – 30Sn high-temperature, lead-free solder inneutral NaCl solution. Corrosion Science. 2018;140:40–50. DOI: 10.1016/j.corsci.2018.06.025.
- Kim Y-S, Kim K-S, Hwang C-W, Suganuma K. Effect of composition and cooling rate on microstructure and tensile properties of Sn – Zn – Bi alloys. Journal Alloys and Compounds. 2003;352(1–2):237–245. DOI: 10.1016/S0925-8388(02)01168-4.
- Chen K-I, Cheng S-C, Wu S, Lin K-L. Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn – 9Zn eutectic alloy. Journal of Alloys and Compounds. 2006;416(1–2):98–105. DOI: 10.1016/j.jallcom.2005.08.034.
- Kumar KM, Kripesh V, Shen L, Zeng K, Tay AAO. Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications. Materials Science and Engineering: A. 2006;423(1–2):57–63. DOI: 10.1016/j.msea.2006.01.088.
- McCormack M, Jin S, Chen HS, Machusak DA. New lead-free, Sn – Zn – In solder alloys. Journal of Electronic Materials. 1994;23(7):687–690. DOI: 10.1007/BF02653357.
- Yoon SW, Son JR, Lee HM, Lee B-J. Thermodinamics-aided alloy design and evaluation of Pb-free solder Sn – Bi – In – Zn system. Acta Materialia. 1997;45(3):951–960. DOI: 10.1016/S1359-6454(96)00253-4.
- Song J-M, Wu Z-M. Variable eutectic temperature caused by inhomogeneous solute distribution in Sn – Zn system. Scripta Materialia. 2006;54(8):1479–1483. DOI: 10.1016/j.scriptamat.2005.12.056.
- Shepelevich VG, Gusakova OV, Koukharenko EL, Husakova SV. Microstructural studies of ultrarapidly quenched foils of zincdoped indium – tin eutectic alloys. Journal of Materials Science. 2019;54(3):2577–2584. DOI: 10.1007/s10853-018-2964-2.
- Gusakova OV, Shepelevich VG. [Microstructure of rapidly solidified alloys of the Sn – Zn – Bi – In system]. Fizika metallov i metallovedenie. 2018;119(5):510–517. Russian. DOI: 10.7868/S001532301805011X.
- Gusakova O, Shepelevich V. The influence of melt flow on grain structure of tin and its alloys produced by ultrafast quenching from the melt. In: IOP Conference Series: Materials Science and Engineering. 2017;192(1):012015. DOI: 10.1088/1757-899X/192/1/012015.
- Pashkov IN, Pikinov MV, Tavolzhansky SA, Pashkov AI. Development of production and use of solder alloys microcrystalline or amorphous structure. Metallurgist. 2010;54:358–361. DOI: 10.1007/s11015-010-9303-4.
- Gusakova OV, Shepelevich VG. Bystrozatverdevshie splavy olova [Rapidly solidified tin alloys]. Minsk: National Institute for Higher Education; 2012. 150 p. Russian.
- Saltukov SА. Stereometricheskaya metallografiya [Stereometric metallography]. Moscow: Metallurgiya; 1976. 270 p. Russian.
- Nikolsky BP, Rabinovich RA. Spravochnik khimika. Tom 1 [Handbook of the chemist. Volume 1]. Moscow: Khimiya; 1966. 1071 p. Russian.
- Gusakova OV, Shepelevich VG, Lozenko VV. Rapidly solidified zink alloys. Minsk: National Institute for Higher Education; 2016. 110 p. Russian.
- Gusakova OV, Shepelevich VG. [Decomposition of supersaturated solid solution in rapidly solidified foils of tin-cadmium alloys]. Fizika metallov i metallovedenie. 2014;115(2):143–148. Russian.
- Gusakova OV, Shepelevich VG. [Structure and properties of rapidly solidified foils of alloys of Sn – Zn – Bi system]. Perspektivnye materialy. 2010;2:74–80. Russian.
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