Charging properties of thin gate dielectrics, obtained by the method of rapid thermal processing

  • Natalya S. Kovalchuk «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Yuliya A. Marudo «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Anna A. Omelchenko «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Uladzimir A. Pilipenka «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Vitali A. Saladukha «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Sergey A. Demidovich «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Vladimir V. Kolos «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Victor M. Anishchik Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus
  • Viktar A. Filipenia «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus
  • Dmitry V. Shestovski «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus https://orcid.org/0000-0002-4259-3276

Abstract

The charge properties of thin dielectrics, obtained by rapid thermal processing (RTP), and their interfaces with silicon for MOS transistors are investigated. The production of insulator layers was carried out by a two- or three-stage RTP with photon processing regimes similar for each stage (duration – 12 s, maximum temperature – 1250 °C). After the third stage of RTP in a nitrogen atmosphere of the gate oxides, obtained by a two-stage process in oxygen atmosphere, the defects responsible for local charge centers are partially eliminated. There is also an increase in the relative value of the surface potential by an average of 100 relative units. The elimination of defects is a consequence of the rearrangement of the structure of the dielectric, its interface with silicon, and the diffusion of oxygen and silicon atoms along the interface of the insulator layer. For samples obtained by a two-stage RTP in an oxygen atmosphere and subjected to the third stage of processing in a forming gas, there is an almost complete elimination of local charge centers and an increase in the relative value of the surface potential by an average of 300 relative units. In this case, in addition to the processes occurring during the treatment of SiO2 by the RTP method in an nitrogen atmosphere, the liquidation of charge centers is a consequence of the passivation of defects by hydrogen atoms.

Author Biographies

Natalya S. Kovalchuk, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

PhD (engineering), docent; deputy chief engineer

Yuliya A. Marudo, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

engineer at the state center «Belmicroanalysis», branch STC «Belmicrosystems»

Anna A. Omelchenko, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

engineer at the state center «Belmicroanalysis», branch STC «Belmicrosystems»

Uladzimir A. Pilipenka, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

сorresponding member of the National Academy of Sciences of Belarus, doctor of science (engineering), full professor; deputy director for scientific development at the state center «Belmicroanalysis», branch STC «Belmicrosystems»

Vitali A. Saladukha, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

doctor of science (engineering); general director

Sergey A. Demidovich, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

leading engineer at the industrial laboratory of new technologies and materials

Vladimir V. Kolos, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

PhD (physics and mathematics); chief of the industrial laboratory of new technologies and materials

Victor M. Anishchik, Belarusian State University, 4 Niezaliežnasci Avenue, Minsk 220030, Belarus

doctor of science (physics and mathematics), full professor; professor at the department of solid state physics, faculty of physics

Viktar A. Filipenia, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

leading engineer at the state center «Belmicroanalysis», branch STC «Belmicrosystems»

Dmitry V. Shestovski, «Integral» – Holding Management Company, 121A Kazinca Street, Minsk 220108, Belarus

engineer-technologist at the department of advanced technological processes

References

  1. Ahopelto J, Ardila G, Baldi L, Balestra F, Belot D, Fagas G, et al. NanoElectronics Roadmap for Europe: from nanodevices and innovative materials to system integration. Solid-State Electronics. 2019;155:7–19. DOI: 10.1016/j.sse.2019.03.014.
  2. Balestra F. Challenges for high performance and very low power operation at the end of the Roadmap. Solid-State Electronics. 2019;155:27–31. DOI: 10.1016/j.sse.2019.03.011.
  3. Omura Y, Mallik A, Matsuo N. MOS devices for low-voltage and low-energy applications. Singapore: John Wiley & Sons; 2017. 496 p.
  4. Deleonibus S, editor. Electronic device architectures for the nano-CMOS era: from ultimate CMOS scaling to beyond CMOS devices. Boca Raton: CRC Press; 2009. 426 p.
  5. Borisenko VE, Hesketh PJ. Rapid thermal processing of semiconductors. New York: Springer Science + Business Media; 1997. XXII, 358 p. (Microdevices: physics and fabrication technologies).
  6. Fair RB, editor. Rapid thermal processing: science and technology. Boston: Academic Press; 1993. VIII, 430 p.
  7. Krasnikov GYa. Konstruktivno-tekhnologicheskie osobennosti submikronnykh MOP-tranzistorov [Design and technological features of submicron MOS transistors]. 2nd edition. Moscow: Tekhnosfera; 2011. 799 p. Russian.
  8. Hu GQ, Lu J, Shen JY, Xu XP. Surface characterization of silicon wafers polished by three different methods. Key Engineering Materials. 2011;487:233–237. DOI: 10.4028/www.scientific.net/KEM.487.233.
  9. Nalivaiko OYu, Saladukha VA, Pilipenka UA, Kolos VV, Belous AI, Lipinskaya TI, et al. Bazovye tekhnologicheskie protsessy izgotovleniya poluprovodnikovykh priborov i integral’nykh mikroskhem na kremnii. Tom 1 [Basic technological processes for the manufacture of semiconductor devices and integrated microcircuits on silicon. Volume 1]. Turtsevich AS, editor. Minck: Integralpoligraf; 2013. 703 p. Russian.
  10. Doering R, Nishi Y, editors. Handbook of semiconductor manufacturing technology. 2nd edition. Воса Raton: CRC Press; 2008. 1720 p.
  11. Reinhardt KA, Reidy RF, editors. Handbook for cleaning for semiconductor manufacturing: fundamentals and applications. Hoboken: John Wiley & Sons; 2011. 614 p. Co-published by the Scrivener Publishing LLC.
  12. Pilipenko VA, Saladukha VA, Filipenya VA, Vorobey RI, Gusev OK, Zharin AL, et al. Characterization of the electrophysical properties of silicon – silicon dioxide interface using probe electrometry methods. Devices and Methods of Measurements. 2017;8(4):344–356. Russian.
  13. Kovalchuk NS, Omelchenko AA, Pilipenko VA, Solodukha VA, Shestovski DV. Formation of a gate dielectric of nanometer thickness by rapid thermal treatment. Doklady BGUIR. 2021;19(4):103–112. Russian. DOI: 10.35596/1729-7648-2021-19-4-103-112.
  14. Gritsenko VA. Atomic structure of the amorphous nonstoichiometric silicon oxides and nitrides. Uspekhi fizicheskikh nauk. 2008;178(7):727–737. Russian. DOI: 10.3367/UFNr.0178.200807c.0727.
  15. Xiaoge Gregory Zhang. Electrochemistry of silicon and its oxide. Boston: Springer Science + Business Media; 2001. XXVI, 510 p. DOI: 10.1007/b100331.
  16. Rodionov YuA. Tekhnologicheskie protsessy v mikro- i nanoelektronike [Technological processes in micro- and nanoelectronics]. Moscow: Infra-Inzheneriya; 2019. 353 p. Russian.
  17. Takahagi T, Sakaue H, Shingubara S. Adsorbed water on a silicon wafer surface exposed to atmosphere. Japanese Journal of Applied Physics. 2001;40(11R):6198–6201. DOI: 10.1143/JJAP.40.6198.
  18. CarimAH, Sinclair R. The evolution of Si/SiO2 interface roughness. Journal of the Electrochemical Society. 1987;134(3):741–746.
  19. Odzaev VB, Panfilenka AK, Pyatlitski AN, Prasalovich US, Kovalchuk NS, Soloviev YaA, et al. Influence of nitrogen ion implantation on the electrophysical properties of the gate dielectric of power MOSFETs. Journal of the Belarusian State University. Physics. 2020;3:55–64. Russian. DOI: 10.33581/2520-2243-2020-3-55-64.
  20. Nalwa HS, editor. Handbook of surfaces and interfaces of materials. San Diego: Academic Press; 2001. 5 volumes.
  21. Fleetwood DM. Border traps and bias-temperature instabilities in MOS devices. Microelectronics Reliability. 2018;80:266–277. DOI: 10.1016/j.microrel.2017.11.007.
  22. Grasser T, editor. Noise in nanoscale semiconductor devices. Cham: Springer Nature; 2020. VI, 729 p.
Published
2022-01-28
Keywords: gate dielectric, rapid thermal processing, three-stage process, surface potential
How to Cite
Kovalchuk, N. S., Marudo, Y. A., Omelchenko, A. A., Pilipenka, U. A., Saladukha, V. A., Demidovich, S. A., Kolos, V. V., Anishchik, V. M., Filipenia, V. A., & Shestovski, D. V. (2022). Charging properties of thin gate dielectrics, obtained by the method of rapid thermal processing. Journal of the Belarusian State University. Physics, 1, 80-87. https://doi.org/10.33581/2520-2243-2022-1-80-87
Section
Semiconductor Physics and Engineering