Application of the rapid thermal treatment for annealing the ion-doped layers of polysilicon
Abstract
The possibility to apply the rapid thermal treatment procedure for the formation of ion-doped layers in polycrystalline silicon is considered. It is demonstrated that such rapid thermal treatment allows one to reduce redistribution of the implanted admixture, to make its electric activation more complete. The accelerated diffusion process of the admixture implanted into polycrystalline silicon with the use of the intense light flux is consistently explained.
References
- Turtsevich A. S., Anufriev L. P. [Polycrystalline Silicon Films in the Production Technology of Integrated Circuits and Semiconductor Devices]. Minsk, 2006.
- Vogler D., Doe P. ALD Special Report: Whereʼs the metal? Solid State Technol. 2003. No. 1. P. 35–40.
Copyright (c) 2017 Journal of the Belarusian State University. Physics
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
The authors who are published in this journal agree to the following:
- The authors retain copyright on the work and provide the journal with the right of first publication of the work on condition of license Creative Commons Attribution-NonCommercial. 4.0 International (CC BY-NC 4.0).
- The authors retain the right to enter into certain contractual agreements relating to the non-exclusive distribution of the published version of the work (e.g. post it on the institutional repository, publication in the book), with the reference to its original publication in this journal.
- The authors have the right to post their work on the Internet (e.g. on the institutional store or personal website) prior to and during the review process, conducted by the journal, as this may lead to a productive discussion and a large number of references to this work. (See The Effect of Open Access.)